TT.IV.E
11:00 - 12:30
Materials and technologies for flexible electronics | ||
SYNOPSIS |
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TT.IV.E.1 |
Ravinder DAHIYA CV |
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TT.IV.E.2 |
Piero COSSEDDU CV |
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TT.IV.E.3 | Dario GASTALDI Polytechnic of Milan In-situ electromechanical testing of stretchable metal/polymer interconnects abst |
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TT.IV.E.4 |
Luca FRANCIOSO CV |
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Chair: Leandro LORENZELLI, FBK, Trento In collaboration with: FBK |
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SYNOPSIS
Materials and technologies for flexible, stretchable sensors and electronics have received increasing attention in the last couple of decades. Thin devices encompass properties like compliance, bendability, conformability, elasticity, lightweight, etc. for a wide range of applications. Here, the overall size of the systems rather than the minimum feature size of an individual circuit component represents the primary scaling metric. An emerging direction in research is to develop innovative materials and techniques, for increasing performances and functionalities, decreasing costs (per unit area), and enabling large area electronic systems. To this end, this session brings together speakers with complementary expertise in flexible electronics, sensors, modelling, and robotics from key academic and research institutes. The session will be focused to illustrate a limited set of candidate technologies for flexible electronics encompassing the topics of electronic skin, low voltage thin film transistors, stretchable metal/polymer interconnects, and their applicative scenarios on robotics, prosthetics, and chemical/physical sensing. |