TS.IV.B
| Advances in structural and strain analysis at the nanoscale |
 |
| Micro- and nano-scale 3D structural and strain analysis is crucial in many technological applications, e.g., micro- and nano-electromechanical systems, nanoelectronics, thin films and coatings. In this symposium, some methodologies to address this scientific and technological issue are presented. Among those based on electron microscopy: focused ion beam is presented as a tool useful to develop methods micro-scale residual stress assessment in thin films; precession electron diffraction under TEM is demonstrated for the study of nanomaterials orientation and strain analysis at 1 nm scale; by monitoring nanoindentation experiments by SEM understanding blistering in thin films caused by residual stresses. Finally, analysis of nanoindentation results is used to calculate spatial stress profiles and to optimize scratch and tribology tests. | Sep 21 17:15 18:45 |
